Sippel, Mark
Mark Sippel, M. Sc.
Department Elektrotechnik-Elektronik-Informationstechnik (EEI)
Lehrstuhl für Hochfrequenztechnik
Konrad-Zuse-Straße 3
91052 Erlangen
- Telefon: +49 9131 85-23316
- Faxnummer: +49 9131 85-27212
- E-Mail: mark.sippel@fau.de
- Webseite: http://lhft.de/mitarbeiter/data/mark-sippel.shtml
Neueste Veröffentlichungen
- M. Kleinlein, K. Lomakin, F. Rösner, A. Hofmann, M. Sippel and G. Gold, "Additively manufactured antennas based on slotted ridged waveguides for 77 GHz MIMO radar applications", in Proceedings of the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy, Dezember, 2023.
DOI: 10.1109/CAMA57522.2023.10352716 - K. Lomakin, S. Alhasson, A. Hofmann, M. Sippel and G. Gold, "Monolithic Additively Manufactured Conformal 4x4 MIMO Radar Frontend based on Slotted Waveguide Array Antennas for 77 GHz Corner Radar", in Proceedings of the 2023 IEEE Conference on Antenna Measurements and Applications (CAMA), Genoa, Italy, November, 2023.
DOI: 10.1109/CAMA57522.2023.10352679 - A. Hofmann, K. Lomakin, M. Kleinlein, T. Bader, M. Sippel and G. Gold, "SLS-Printed E-Band Waveguides and the Impact of Surface Roughness", in Proceedings of the European Microwave Conference (EuMC), Berlin, 2023.
- A. Hofmann, L. Klein, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications", in Proceedings of the European Microwave Conference (EuMC), Milan, Italy, September, 2022.
DOI: 10.23919/eumc54642.2022.9924342 - A. Hofmann, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured Slotted Waveguides for THz Applications", in Proceedings of the IEEE/MTT-S International Microwave Symposium (IMS), Denver, CO, Juni, 2022.
DOI: 10.1109/ims37962.2022.9865365 - A. Hofmann, K. Lomakin, M. Sippel and G. Gold, "Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications", in Proceedings of the German Microwave Conference, Ulm, Mai, 2022.
- F. Hubert, T. Bader, L. Wahl, A. Hofmann, K. Lomakin, M. Sippel, N. Travitzky and G. Gold, "Additive Manufactured Waveguide for E-Band Using Ceramic Materials", Applied Sciences, vol. 12, no. 1, Dezember, 2021.
DOI: 10.3390/app12010212 - H. Tesmer, G. Gold, F. Bachbauer, E. Polat, M. Sippel, R. Jakoby, M. Vossiek and H. Maune, "Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides", IEEE Microwave and Wireless Components Letters, pp. 1-1, Mai, 2021.
DOI: 10.1109/LMWC.2021.3082700 - K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "3D Printed Slotted Waveguide Array Antenna for D-Band Applications", in Proceedings of the 2021 15th European Conference on Antennas and Propagation (EuCAP), Düsseldorf, März, 2021.
DOI: 10.23919/EuCAP51087.2021.9410911 - S. Neermann, J. Franke, M. Sippel, K. Lomakin and G. Gold, "RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics", in Proceedings of the 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings, Februar, 2021.
DOI: 10.1109/MID50463.2021.9361629 - L. Klein, K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "Additively Manufactured Six-Port for mmWave Applications", in Proceedings of the 2020 50th European Microwave Conference (EuMC), Utrecht, Januar, 2021.
DOI: 10.23919/EuMC48046.2021.9338044 - K. Lomakin, L. Klein, M. Sippel, K. Helmreich and G. Gold, "3D-Printed 3 dB Hybrid Coupler for D-Band Applications", in Proceedings of the 2020 50th European Microwave Conference (EuMC), Utrecht, Januar, 2021.
DOI: 10.23919/EuMC48046.2021.9337997 - S. Neermann, J. Franke, M. Sippel, K. Lomakin and G. Gold, "Reliability of Printed Microwave Electronics", in Proceedings of the IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), pp. 1791-1796, , ELECTR NETWORK, Januar, 2021.
DOI: 10.1109/ECTC32696.2021.00283 - K. Lomakin, M. Sippel, K. Helmreich and G. Gold, "Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating", in Proceedings of the 2020 IEEE/MTT-S International Microwave Symposium (IMS), Los Angeles, CA, Juni, 2020.
DOI: 10.1109/IMS30576.2020.9223819 - K. Lomakin, M. Sippel, I. Ullmann, K. Helmreich and G. Gold, "3D Printed Helix Antenna for 77 GHz", in Proceedings of the 2020 14th European Conference on Antennas and Propagation (EuCAP), Copenhagen, Denkmark, März, 2020.
DOI: 10.23919/EuCAP48036.2020.9135996 - K. Lomakin, S. Herold, L. Ringel, J. Ringel, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 12, pp. 2476-2481, Dezember, 2019.
DOI: 10.1109/TCPMT.2019.2927671 - K. Lomakin, R. Guschlbauer, F. Osmanlic, Z. Fu, M. Sippel, K. Helmreich, C. Körner, M. Vossiek and G. Gold, "3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band", in Proceedings of the EuMW 2019, Paris, Oktober, 2019.
DOI: 10.23919/EuMC.2019.8910893 - M. Sippel, K. Lomakin, M. Ankenbrand, M. Petersen, J. Franke, K. Helmreich, M. Vossiek and G. Gold, "3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy", in Proceedings of the 28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019), Montreal, Oktober, 2019.
DOI: 10.1109/EPEPS47316.2019.193232 - F. Distler, M. Sippel, J. Schür, G. Gold, K. Helmreich and M. Vossiek, "Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects", IEEE Transactions on Microwave Theory and Techniques, vol. 67, no. 11, pp. 4298-4307, September, 2019.
DOI: 10.1109/TMTT.2019.2939831 - K. Lomakin, L. Klein, L. Ringel, J. Ringel, M. Sippel, K. Helmreich and G. Gold, "3D Printed E-Band Hybrid Coupler", IEEE Microwave and Wireless Components Letters, vol. 29, no. 9, pp. 580-582, September, 2019.
DOI: 10.1109/LMWC.2019.2931458 - K. Lomakin, S. Herold, D. Simon, M. Sippel, A. Sion, M. Vossiek, K. Helmreich and G. Gold, "3D Printed Slotted Rectangular Hollow Waveguides", in Proceedings of the IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019., Boston, MA, Juni, 2019.
DOI: 10.1109/MWSYM.2019.8700864 - K. Lomakin, M. Ankenbrand, M. Sippel, J. Franke, K. Helmreich and G. Gold, "Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz", in Proceedings of the 1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019), Glasgow, 2019.
DOI: 10.1109/fleps.2019.8792231 - M. Köppel, M. Deckelmann, M. Sippel, K. Lomakin, S. Werzinger, G. Gold, K. Helmreich and B. Schmauß, "Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications", in Proceedings of the SPIE Optics + Photonics: Optical Engineering + Applications, San Diego, US, 2018.
DOI: 10.1117/12.2320944 - K. Lomakin, M. Sippel, G. Gold, J. Ringel, D. Weiß, K. Helmreich, M. Ankenbrand and J. Franke, "Substituting bond wires by additively manufactured interconnections", in Proceedings of the German Microwave Conference, 2018.
DOI: 10.23919/gemic.2018.8335106 - K. Lomakin, M. Sippel, G. Gold, J. Fröhlich, K. Helmreich, M. Ankenbrand and J. Franke, "Low reflective aerosol Jet printed broadband matched load up to 67 GHz", in Proceedings of the German Microwave Conference, 2018.
DOI: 10.23919/gemic.2018.8335109 - K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, K. Helmreich, M. Ankenbrand, N. Urban and A. Franke, "Impact of Surface Roughness on 3D printed SLS Horn Antennas", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), 2018.
DOI: 10.1049/cp.2018.1235 - M. Ankenbrand, M. Scheetz, J. Franke, K. Lomakin, M. Sippel, G. Gold and K. Helmreich, "Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies", in Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID), 2018.
DOI: 10.1109/ICMID.2018.8527052 - K. Lomakin, T. Pavlenko, M. Ankenbrand, M. Sippel, J. Ringel, M. Scheetz, T. Klemm, D. Gräf, K. Helmreich, J. Franke and G. Gold, "Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, 2018.
DOI: 10.1109/tcpmt.2018.2871931 - M. Ankenbrand, J. Franke, K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, D. Weiß and K. Helmreich, "Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren", PLUS - Produktion von Leiterplatten und Systemen, 2018.
- K. Lomakin, D. Simon, M. Sippel, G. Gold, K. Helmreich, E. Seler, Z. Tong and R. Reuter, "3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band", in Proceedings of the 48th European Microwave Conference (EuMW 2018), 2018.
DOI: 10.23919/EuMC.2018.8541536 - K. Lomakin, T. Pavlenko, M. Sippel, G. Gold, T. Weidner, K. Helmreich, M. Ankenbrand and J. Franke, "3D Printed Helix Antenna", in Proceedings of the European Conference on Antennas and Propagation (EUCAP), London, GB, 2018.
DOI: 10.1049/cp.2018.1034 - M. Sippel, K. Lomakin, G. Gold, T. Reitberger, S. Neermann and K. Helmreich, "Simple Approach for brief RF Characterization of thin 3D printable Dielectrics", in Proceedings of the 21st IEEE Workshop on Signal and Power Integrity (SPI 2017), Baveno, IT, 2017.
DOI: 10.1109/SaPIW.2017.7944043 - M. Sippel, K. Lomakin, G. Gold and K. Helmreich, "Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz", Electronics, 2017.
DOI: 10.3390/electronics6040109 - K. Lomakin, M. Sippel, G. Gold, P. Rochholz, K. Helmreich, M. Ankenbrand, D. Gräf and J. Franke, "Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen", PLUS - Produktion von Leiterplatten und Systemen, 2017.
- M. Sippel, G. Gold and K. Helmreich, "Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures", in Proceedings of the 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, 2016.
DOI: 10.1109/SaPIW.2016.7496290