Sippel, Mark – Institute of Microwaves and Photonics

Mark Sippel, M. Sc.

Department of Electrical-Electronic-Communication Engineering
Institute of Microwaves and Photonics (LHFT)

Raum 01.038
Konrad-Zuse-Straße 3
91052 Erlangen

Phone number: +49 9131 85-23316
Fax number: +49 9131 85-27212
Email: mark.sippel@fau.de
Website: http://lhft.de/mitarbeiter/data/mark-sippel.shtml

Publications

Kleinlein M., Lomakin K., Rösner F., Hofmann A., Sippel M., Gold G.:
Additively manufactured antennas based on slotted ridged waveguides for 77 GHz MIMO radar applications
2023 IEEE Conference on Antenna Measurements and Applications (CAMA) (Genoa, Italy, 15. November 2023 - 17. November 2023)
DOI: 10.1109/CAMA57522.2023.10352716
URL: https://ieeexplore.ieee.org/document/10352716
Lomakin K., Alhasson S., Hofmann A., Sippel M., Gold G.:
Monolithic Additively Manufactured Conformal 4x4 MIMO Radar Frontend based on Slotted Waveguide Array Antennas for 77 GHz Corner Radar
2023 IEEE Conference on Antenna Measurements and Applications (CAMA) (Genoa, Italy, 15. November 2023 - 17. November 2023)
DOI: 10.1109/CAMA57522.2023.10352679
Hofmann A., Lomakin K., Kleinlein M., Bader T., Sippel M., Gold G.:
SLS-Printed E-Band Waveguides and the Impact of Surface Roughness
European Microwave Conference (EuMC) (Berlin, 17. September 2023 - 22. September 2023)
Hofmann A., Klein L., Lomakin K., Sippel M., Gold G.:
Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications
European Microwave Conference (EuMC) (Milan, Italy)
DOI: 10.23919/eumc54642.2022.9924342
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Slotted Waveguides for THz Applications
International Microwave Symposium (IMS) (Denver, CO)
In: IEEE/MTT-S International Microwave Symposium (IMS) 2022
DOI: 10.1109/ims37962.2022.9865365
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications
German Microwave Conference (GeMIC) (Ulm)
In: German Microwave Conference 2022
Hubert F., Bader T., Wahl L., Hofmann A., Lomakin K., Sippel M., Travitzky N., Gold G.:
Additive Manufactured Waveguide for E-Band Using Ceramic Materials
In: Applied Sciences 12 (2021), Article No.: 212
ISSN: 2076-3417
DOI: 10.3390/app12010212
URL: https://www.mdpi.com/2076-3417/12/1/212
Tesmer H., Gold G., Bachbauer F., Polat E., Sippel M., Jakoby R., Vossiek M., Maune H.:
Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides
In: IEEE Microwave and Wireless Components Letters (2021), p. 1-1
ISSN: 1531-1309
DOI: 10.1109/LMWC.2021.3082700
Lomakin K., Sippel M., Helmreich K., Gold G.:
3D Printed Slotted Waveguide Array Antenna for D-Band Applications
2021 15th European Conference on Antennas and Propagation (EuCAP) (Düsseldorf, 22. March 2021 - 26. March 2021)
In: 2021 15th European Conference on Antennas and Propagation (EuCAP) 2021
DOI: 10.23919/EuCAP51087.2021.9410911
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics
14th International Congress Molded Interconnect Devices, MID 2021 (, 8. February 2021 - 11. February 2021)
In: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings 2021
DOI: 10.1109/MID50463.2021.9361629
Klein L., Lomakin K., Sippel M., Helmreich K., Gold G.:
Additively Manufactured Six-Port for mmWave Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338044
Lomakin K., Klein L., Sippel M., Helmreich K., Gold G.:
3D-Printed 3 dB Hybrid Coupler for D-Band Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9337997
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
Reliability of Printed Microwave Electronics
IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK)
In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), LOS ALAMITOS: 2021
DOI: 10.1109/ECTC32696.2021.00283
Lomakin K., Sippel M., Helmreich K., Gold G.:
Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating
International Microwave Symposium (Los Angeles, CA, 21. June 2020 - 26. June 2020)
In: 2020 IEEE/MTT-S International Microwave Symposium (IMS) 2020
DOI: 10.1109/IMS30576.2020.9223819
Lomakin K., Sippel M., Ullmann I., Helmreich K., Gold G.:
3D Printed Helix Antenna for 77 GHz
14th European Conference on Antennas and Propagation (Copenhagen, Denkmark, 15. March 2020 - 20. March 2020)
In: 2020 14th European Conference on Antennas and Propagation (EuCAP) 2020
DOI: 10.23919/EuCAP48036.2020.9135996
Lomakin K., Herold S., Ringel L., Ringel J., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating
In: IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2019), p. 2476-2481
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2927671
Lomakin K., Guschlbauer R., Osmanlic F., Fu Z., Sippel M., Helmreich K., Körner C., Vossiek M., Gold G.:
3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band
EuMW 2019 (Paris)
DOI: 10.23919/EuMC.2019.8910893
Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
DOI: 10.1109/EPEPS47316.2019.193232
Distler F., Sippel M., Schür J., Gold G., Helmreich K., Vossiek M.:
Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 4298-4307
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2939831
Lomakin K., Klein L., Ringel L., Ringel J., Sippel M., Helmreich K., Gold G.:
3D Printed E-Band Hybrid Coupler
In: IEEE Microwave and Wireless Components Letters 29 (2019), p. 580-582
ISSN: 1531-1309
DOI: 10.1109/LMWC.2019.2931458
Lomakin K., Herold S., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
3D Printed Slotted Rectangular Hollow Waveguides
IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019. (Boston, MA)
DOI: 10.1109/MWSYM.2019.8700864
Lomakin K., Ankenbrand M., Sippel M., Franke J., Helmreich K., Gold G.:
Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz
1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) (Glasgow, 7. July 2019 - 10. July 2019)
DOI: 10.1109/fleps.2019.8792231
Köppel M., Deckelmann M., Sippel M., Lomakin K., Werzinger S., Gold G., Helmreich K., Schmauß B.:
Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications
In: SPIE Optics + Photonics: Optical Engineering + Applications 2018
DOI: 10.1117/12.2320944
Lomakin K., Sippel M., Gold G., Ringel J., Weiß D., Helmreich K., Ankenbrand M., Franke J.:
Substituting bond wires by additively manufactured interconnections
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335106
Lomakin K., Sippel M., Gold G., Fröhlich J., Helmreich K., Ankenbrand M., Franke J.:
Low reflective aerosol Jet printed broadband matched load up to 67 GHz
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335109
Lomakin K., Pavlenko T., Sippel M., Gold G., Helmreich K., Ankenbrand M., Urban N., Franke A.:
Impact of Surface Roughness on 3D printed SLS Horn Antennas
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1235
Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
2018 13th International Congress Molded Interconnect Devices (MID)
DOI: 10.1109/ICMID.2018.8527052
Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), p. 1-1
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2018.2871931
Ankenbrand M., Franke J., Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Weiß D., Helmreich K.:
Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2018)
Lomakin K., Simon D., Sippel M., Gold G., Helmreich K., Seler E., Tong Z., Reuter R.:
3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band
In: 48th European Microwave Conference (EuMW 2018) 2018
DOI: 10.23919/EuMC.2018.8541536
Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Helmreich K., Ankenbrand M., Franke J.:
3D Printed Helix Antenna
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1034
Sippel M., Lomakin K., Gold G., Reitberger T., Neermann S., Helmreich K.:
Simple Approach for brief RF Characterization of thin 3D printable Dielectrics
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944043
Sippel M., Lomakin K., Gold G., Helmreich K.:
Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz
In: Electronics (2017)
ISSN: 0013-5070
DOI: 10.3390/electronics6040109
Lomakin K., Sippel M., Gold G., Rochholz P., Helmreich K., Ankenbrand M., Gräf D., Franke J.:
Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen
In: PLUS - Produktion von Leiterplatten und Systemen (2017)
Sippel M., Gold G., Helmreich K.:
Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures
20th IEEE Workshop on Signal and Power Integrity, SPI 2016
DOI: 10.1109/SaPIW.2016.7496290