Bader, Tobias

Tobias Bader, M. Sc.

Department of Electrical-Electronic-Communication Engineering
Institute of Microwaves and Photonics (LHFT)

Publications

  • L. Hahn, T. Bader, C. Carlowitz, M. Vossiek and G. Gold, "Tight Non-Radiating Bends of 3D-Printed Dielectric Image Lines Based on Electromagnetic Bandgap Mirrors", in Proceedings of the 2024 IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater, Mai, 2024.
    DOI: 10.1109/WAMICON60123.2024.10522856
  • T. Bader and G. Gold, "Towards Dielectric Chip-to-Chip Interconnects for THz Applications", in Proceedings of the 2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024, Clearwater, FL, USA, 2024.
    DOI: 10.1109/WAMICON60123.2024.10522803
  • L. Hahn, T. Pfahler, T. Bader, G. Gold, M. Vossiek and C. Carlowitz, "3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications", in Proceedings of the 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024, Tel Aviv, ISR, 2024.
    DOI: 10.1109/COMCAS58210.2024.10666228
  • A. Wittmann, T. Bader, S. Alidoust Chamandani, O. Hentschel, M. Schmidt and G. Gold, "Feasibility of Manufacturing Dielectric Image Lines by Using Laser-Based Directed Energy Deposition of Polymers", IEEE Access, Oktober, 2023.
    DOI: 10.1109/ACCESS.2023.3325197
  • T. Bader, K. Lomakin and G. Gold, "Ultra Wideband Power Detector for W-Band Applications Using a Novel Additively Manufactured Wave Mode Transducer", in Proceedings of the 2023 IEEE Wireless and Microwave Technology Conference, WAMICON 2023, pp. 69-72, 2023.
    DOI: 10.1109/WAMICON57636.2023.10124907
  • A. Hofmann, K. Lomakin, M. Kleinlein, T. Bader, M. Sippel and G. Gold, "SLS-Printed E-Band Waveguides and the Impact of Surface Roughness", in Proceedings of the European Microwave Conference (EuMC), Berlin, 2023.
  • F. Hubert, T. Bader, L. Wahl, A. Hofmann, K. Lomakin, M. Sippel, N. Travitzky and G. Gold, "Additive Manufactured Waveguide for E-Band Using Ceramic Materials", Applied Sciences, vol. 12, no. 1, Dezember, 2021.
    DOI: 10.3390/app12010212