Gold, Gerald – Institute of Microwaves and Photonics

Dr.-Ing. Gerald Gold, Akad. Rat

Research Group Leader: Microwave Assembly and Interconnects

Department of Electrical-Electronic-Communication Engineering
Institute of Microwaves and Photonics (LHFT)

Raum 00.024
Konrad-Zuse-Straße 7
91052 Erlangen

Phone number: +49 9131 85-23165
Fax number: +49 9131 85-27212
Email: gerald.gold@fau.de
Website: http://www.lhft.eei.uni-erlangen.de/mitarbeiter/data/gerald-gold.shtml

Forschungsschwerpunkte

Elektromagnetische Wechselwirkung an nichtidealen Materialübergängen, insbesondere Felder in rauen Metalloberflächen
Numerische Feldsimulation
3D-Druck von passiven HF-Komponenten
3D-HF-Aufbau- und Verbindungstechniken
Entwurf von temporären HF-Prüfadaptionen, insbesondere mit anisotropen Leitelastomeren
Automatisierung von HF-Prüfaufgaben

Positionen und Funktionen

Leitender wissenschaftlicher Mitarbeiter am LHFT
Laborleitung 3D Microwave Assembly & Interconnects Laboratory
Laborleitung Signal Integrity Laboratory

Vita

Scholar profile

Gerald Gold received the Diploma degree in mechatronics and the Dr. Eng. degree from Friedrich-Alexander University Erlangen-Nürnberg (FAU), Erlangen, Germany, in 2009 and 2016, respectively. Since 2010, he is with the the Institute of Microwaves and Photonics, FAU, as a Research Assistant. He became the Group Leader of the Microwave Assembly and Interconnects Group in 2018. His research interests include 3D-printed microwave components, electromagnetic interaction with non-ideal surfaces, and automation of RF-measurements.

Neueste Veröffentlichungen

Panusch D., Birkenhauer C., Gold G.:
Investment Casting of Microwave Components for E-Band
European Microwave Week 2024 (Paris Convention Centre, 1 place de la Porte de Versailles, 75015 Paris, 22. September 2024 - 27. September 2024)
DOI: 10.23919/EuMC61614.2024.10732681
Hahn L., Bader T., Carlowitz C., Vossiek M., Gold G.:
Tight Non-Radiating Bends of 3D-Printed Dielectric Image Lines Based on Electromagnetic Bandgap Mirrors
2024 IEEE Wireless and Microwave Technology Conference (WAMICON) (Clearwater, 15. April 2024 - 16. April 2024)
In: 2024 IEEE Wireless and Microwave Technology Conference (WAMICON) 2024
DOI: 10.1109/WAMICON60123.2024.10522856
Bachbauer F., Lomakin K., Sippel M., Gold G.:
The Limit of Downsizing Dielectric-Filled Slotted Waveguide Antennas
2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 (Clearwater, FL, 15. April 2024 - 16. April 2024)
In: 2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 2024
DOI: 10.1109/WAMICON60123.2024.10522800
Bader T., Gold G.:
Towards Dielectric Chip-to-Chip Interconnects for THz Applications
2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 (Clearwater, FL, USA, 15. April 2024 - 16. April 2024)
In: 2024 IEEE Wireless and Microwave Technology Conference, WAMICON 2024 2024
DOI: 10.1109/WAMICON60123.2024.10522803
Ankenbrand M., Panusch D., Piechulek N., Gold G., Helmreich K., Franke J.:
Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas
23rd International Conference on Electronics Packaging, ICEP 2024 (Toyama, JPN, 17. April 2024 - 20. April 2024)
In: 2024 International Conference on Electronics Packaging, ICEP 2024 2024
DOI: 10.23919/ICEP61562.2024.10535565
Hahn L., Pfahler T., Bader T., Gold G., Vossiek M., Carlowitz C.:
3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications
2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 (Tel Aviv, ISR, 9. July 2024 - 11. July 2024)
In: 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024 2024
DOI: 10.1109/COMCAS58210.2024.10666228
Kleinlein M., Lomakin K., Rösner F., Hofmann A., Sippel M., Gold G.:
Additively manufactured antennas based on slotted ridged waveguides for 77 GHz MIMO radar applications
2023 IEEE Conference on Antenna Measurements and Applications (CAMA) (Genoa, Italy, 15. November 2023 - 17. November 2023)
DOI: 10.1109/CAMA57522.2023.10352716
URL: https://ieeexplore.ieee.org/document/10352716
Mayerhofer M., Brenner S., Helm R., Gruber S., Lopez E., Stepien L., Gold G., Dollinger G.:
Additive Manufacturing of Side-Coupled Cavity Linac Structures from Pure Copper: A First Concept
In: Instruments 7 (2023), Article No.: 56
ISSN: 2410-390X
DOI: 10.3390/instruments7040056
Lomakin K., Alhasson S., Hofmann A., Sippel M., Gold G.:
Monolithic Additively Manufactured Conformal 4x4 MIMO Radar Frontend based on Slotted Waveguide Array Antennas for 77 GHz Corner Radar
2023 IEEE Conference on Antenna Measurements and Applications (CAMA) (Genoa, Italy, 15. November 2023 - 17. November 2023)
DOI: 10.1109/CAMA57522.2023.10352679
Panusch D., Bachbauer F., Lomakin K., Gold G.:
SLA Printed Sub-Terahertz Bifilar Helix Antenna for Radar Imaging
Kleinheubacher Tagung 2023 (Miltenberg, Germany, 26. September 2023 - 28. September 2023)
Wittmann A., Bader T., Alidoust Chamandani S., Hentschel O., Schmidt M., Gold G.:
Feasibility of Manufacturing Dielectric Image Lines by Using Laser-Based Directed Energy Deposition of Polymers
In: IEEE Access (2023)
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2023.3325197
URL: https://ieeexplore.ieee.org/document/10286514/keywords#keywords
Engel L., Khouri D., Lomakin K., Hofmann A., Kleinlein M., Ullmann I., Vossiek M., Gold G.:
3D Printed Hemispherically Radiating Antenna for Broadband Millimeter Wave Applications
In: IEEE Open Journal of Antennas and Propagation 4 (2023), p. 558-570
ISSN: 2637-6431
DOI: 10.1109/OJAP.2023.3279090
Panusch D., Shi J., Lomakin K., Gold G.:
Additively Manufactured Endfire Bifilar Helix Antenna for E-Band
EuCAP 2023 - 17th European Conference on Antennas and Propagation (Fortezza da Basso, Florenz, 26. March 2023 - 31. March 2023)
DOI: 10.23919/eucap57121.2023.10133371
Panusch D., Pelchen L., Müller S., Gold G.:
A Novel Manufacturing Method for Microwave Components by Lost Wax Casting
In: IEEE Access (2023)
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2023.3256274
URL: https://ieeexplore.ieee.org/document/10066171
Ankenbrand M., Panusch D., Utsch D., Banea K., Ehrngruber M., Gold G., Helmreich K., Franke J.:
Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring
SMTA Pan Pacific Microelectronics Symposium 2023 (Kauai, 30. January 2023 - 1. February 2023)
In: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2023 2023
URL: https://smta.org/page/knowledge-search#conference-proceedings/proceedings-by-year/5e46de4c222bfe08592ecfd5/view-publication-details5/64517354b4950300283478bd/entry-details4/645174ed0e46690d6145b460/
Bader T., Lomakin K., Gold G.:
Ultra Wideband Power Detector for W-Band Applications Using a Novel Additively Manufactured Wave Mode Transducer
2023 IEEE Wireless and Microwave Technology Conference, WAMICON 2023
DOI: 10.1109/WAMICON57636.2023.10124907
Hofmann A., Lomakin K., Kleinlein M., Bader T., Sippel M., Gold G.:
SLS-Printed E-Band Waveguides and the Impact of Surface Roughness
European Microwave Conference (EuMC) (Berlin, 17. September 2023 - 22. September 2023)
Pfahler T., Gold G., Bachbauer F., Schür J., Vossiek M.:
Complex Permittivity Extraction of IC-Package Materials beyond 110 GHz by Band-Limited Waveguide-Cavity Measurements
53rd European Microwave Conference, EuMC 2023 (Berlin, DEU, 19. September 2023 - 21. September 2023)
In: 2023 53rd European Microwave Conference, EuMC 2023 2023
DOI: 10.23919/EuMC58039.2023.10290476
Bachbauer F., Lomakin K., Pfahler T., Gold G.:
A Method for Extracting an Apparent Permittivity from Band Limited Measurements of Homogeneously Filled Transmission Lines
2022 52nd European Microwave Conference (EuMC) (Milan, 27. September 2022 - 29. September 2022)
In: Institute of Electrical and Electronics Engineers (IEEE) (ed.): 2022 52nd European Microwave Conference (EuMC) 2022
DOI: 10.23919/EuMC54642.2022.9924444
Lomakin K., Alhasson S., Gold G.:
Evaluation of Crosstalk between Additively Manufactured Slotted Waveguides in mmWave Applications
European Microwave Conference (EuMC) (Milan, Italy, 25. September 2022 - 30. September 2022)
DOI: 10.23919/eumc54642.2022.9924431
Hofmann A., Klein L., Lomakin K., Sippel M., Gold G.:
Additively Manufactured WR15 Waveguide to Microstrip Transition for Broadband V-Band Applications
European Microwave Conference (EuMC) (Milan, Italy)
DOI: 10.23919/eumc54642.2022.9924342
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Slotted Waveguides for THz Applications
International Microwave Symposium (IMS) (Denver, CO)
In: IEEE/MTT-S International Microwave Symposium (IMS) 2022
DOI: 10.1109/ims37962.2022.9865365
Hofmann A., Lomakin K., Sippel M., Gold G.:
Additively Manufactured Broadwall Waveguide Couplers for V-Band Applications
German Microwave Conference (GeMIC) (Ulm)
In: German Microwave Conference 2022
Engel L., Lomakin K., Gold G., Pfahler T., Schür J., Vossiek M.:
3D Printed Waveguide Transition for 77 GHz Radar Applications
2022 14th German Microwave Conference (GeMiC) (Ulm, Germany, 16. May 2022 - 18. May 2022)
In: Published in: 2022 14th German Microwave Conference (GeMiC), Ulm: 2022
Gold G., Engel L.:
Typical Offset of Usable Antenna Bandwidth due to Surface Roughness
22nd IEEE Wireless and Microwave Technology Conference (WAMICON) (Clearwater Beach, FL, 27. April 2022 - 28. April 2022)
DOI: 10.1109/wamicon53991.2022.9786180
Maune H., Hübner KH., Gold G.:
Considerations for V- and W-Band Inter-Satellite Links
22nd IEEE Wireless and Microwave Technology Conference (WAMICON) (Clearwater Beach, FL, 27. April 2022 - 28. April 2022)
DOI: 10.1109/wamicon53991.2022.9786212
Lomakin K., Alhasson S., Gold G.:
3D-Printed Compact Full-E-Band Wavemode Transitions for Direct Launching from IC to Waveguides with minimal Line Length on PCB
22nd IEEE Wireless and Microwave Technology Conference (Clearwater FL, United States, 27. April 2022 - 28. April 2022)
DOI: 10.1109/wamicon53991.2022.9786202
Panusch D., Hubert F., Bachbauer F., Lomakin K., Gold G.:
Additively Manufactured Helix Antenna for X-Band Applications
EuCAP 2022 - 16th European Conference on Antennas and Propagation (Madrid, 27. March 2022 - 1. April 2022)
DOI: 10.23919/EuCAP53622.2022.9769342
Lomakin K., Alhasson S., Gold G.:
Additively Manufactured Amplitude Tapered Slotted Waveguide Array Antenna with Horn Aperture for 77GHz
In: IEEE Access (2022)
ISSN: 2169-3536
DOI: 10.1109/ACCESS.2022.3162830
Lomakin K., Schür J., Gold G.:
Design Optimization of Pyramidal Horn Antennas for 3D Printing in the mm-Wave Range
16th European Conference on Antennas and Propagation (EuCAP) (Madrid, 27. March 2022 - 1. April 2022)
DOI: 10.23919/eucap53622.2022.9769314
Ehrngruber M., Neermann S., Gold G.:
A Transmission Method for Conductivity Extraction of Printed Silver Ink
EuMW (Mailand, 25. September 2022 - 30. September 2022)
In: IEEE 2022
DOI: 10.23919/eumc54642.2022.9924366
Hubert F., Bader T., Wahl L., Hofmann A., Lomakin K., Sippel M., Travitzky N., Gold G.:
Additive Manufactured Waveguide for E-Band Using Ceramic Materials
In: Applied Sciences 12 (2021), Article No.: 212
ISSN: 2076-3417
DOI: 10.3390/app12010212
URL: https://www.mdpi.com/2076-3417/12/1/212
Pfahler T., Gold G., Lomakin K., Engel L., Schür J., Vossiek M.:
Ultra-Wideband Complex Permittivity Extraction of IC Packaging Materials beyond 100 GHz
2021 IEEE MTT-S International Microwave Symposium (Atlanta, 7. July 2021 - 25. July 2021)
DOI: 10.1109/IMS19712.2021.9574950
Lomakin K., Engel L., Fleischmann J., Gold G.:
Additively Manufactured Wavemode Transition for Broadband E-Band Applications
International Microwave Symposium (Atlanta, GA, 6. June 2021 - 11. June 2021)
In: 2021 IEEE/MTT-S International Microwave Symposium (IMS) 2021
DOI: 10.1109/IMS19712.2021.9574889
Tesmer H., Gold G., Bachbauer F., Polat E., Sippel M., Jakoby R., Vossiek M., Maune H.:
Feasibility of Additively Manufactured Tunable Liquid Crystal Loaded Dielectric Waveguides
In: IEEE Microwave and Wireless Components Letters (2021), p. 1-1
ISSN: 1531-1309
DOI: 10.1109/LMWC.2021.3082700
Lomakin K., Sippel M., Helmreich K., Gold G.:
3D Printed Slotted Waveguide Array Antenna for D-Band Applications
2021 15th European Conference on Antennas and Propagation (EuCAP) (Düsseldorf, 22. March 2021 - 26. March 2021)
In: 2021 15th European Conference on Antennas and Propagation (EuCAP) 2021
DOI: 10.23919/EuCAP51087.2021.9410911
Wang L., Lomakin K., Job A., Süß-Wolf R., Gold G., Franke J.:
Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring
14th International Congress Molded Interconnect Devices, MID 2021 (Virtual, 8. February 2021 - 11. February 2021)
In: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings 2021
DOI: 10.1109/MID50463.2021.9361617
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
RF Characterization of the Homogeneity of Sintered Micro- And Nanoparticle Silver Inks for Printed Electronics
14th International Congress Molded Interconnect Devices, MID 2021 (, 8. February 2021 - 11. February 2021)
In: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings 2021
DOI: 10.1109/MID50463.2021.9361629
Lomakin K., Wang L., Job A., Süß-Wolf R., Franke J., Helmreich K., Gold G.:
Additive Manufacturing of Coplanar Transmission Lines on Alumina Substrate up to 24 GHz using Laser Assisted Selective Metallization
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338152
Klein L., Lomakin K., Sippel M., Helmreich K., Gold G.:
Additively Manufactured Six-Port for mmWave Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9338044
Lomakin K., Klein L., Sippel M., Helmreich K., Gold G.:
3D-Printed 3 dB Hybrid Coupler for D-Band Applications
50th European Microwave Week (Utrecht, 12. January 2021 - 14. January 2021)
In: 2020 50th European Microwave Conference (EuMC) 2021
DOI: 10.23919/EuMC48046.2021.9337997
Neermann S., Franke J., Sippel M., Lomakin K., Gold G.:
Reliability of Printed Microwave Electronics
IEEE 71st Electronic Components and Technology Conference (ECTC) (, ELECTR NETWORK)
In: IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), LOS ALAMITOS: 2021
DOI: 10.1109/ECTC32696.2021.00283
Lomakin K., Klein L., Gold G.:
Design and Analysis of 3D Printed Hybrid Couplers for D-Band Applications
In: International Journal of Microwave and Wireless Technologies (2021), Article No.: DOI: 10.1017/S1759078721000647
ISSN: 1759-0787
DOI: 10.1017/S1759078721000647
Lomakin K., Sippel M., Helmreich K., Gold G.:
Design and Analysis of 3D Printed Slotted Waveguides for D-Band using Stereolithography and Electroless Silver Plating
International Microwave Symposium (Los Angeles, CA, 21. June 2020 - 26. June 2020)
In: 2020 IEEE/MTT-S International Microwave Symposium (IMS) 2020
DOI: 10.1109/IMS30576.2020.9223819
Lomakin K., Helmreich K., Gold G.:
Using Group Velocity for Correct Determination of Phase Coefficient Without Initial Phase Assumption
24th Workshop on Signal and Power Integrity (Cologne, 17. May 2020 - 20. May 2020)
In: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI) 2020
DOI: 10.1109/SPI48784.2020.9218183
Ullmann I., Root K., Lomakin K., Gold G., Gottinger M., Helmreich K., Vossiek M.:
Circular Polarization Millimeter-Wave SAR Imaging using 3D-Printed Helix Antennas
SPIE Security + Defense Forum (Edingburgh)
DOI: 10.1117/12.2573952
Lomakin K., Sippel M., Ullmann I., Helmreich K., Gold G.:
3D Printed Helix Antenna for 77 GHz
14th European Conference on Antennas and Propagation (Copenhagen, Denkmark, 15. March 2020 - 20. March 2020)
In: 2020 14th European Conference on Antennas and Propagation (EuCAP) 2020
DOI: 10.23919/EuCAP48036.2020.9135996
Gold G.:
On the Kelvin Transformation in Finite Difference Implementations
In: Electronics (2020), Article No.: 442
ISSN: 2079-9292
DOI: 10.3390/electronics9030442
Lomakin K., Herold S., Ringel L., Ringel J., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
SLA Printed 3D Waveguide Paths for E-Band using Electroless Silver Plating
In: IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2019), p. 2476-2481
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2019.2927671
Lomakin K., Guschlbauer R., Osmanlic F., Fu Z., Sippel M., Helmreich K., Körner C., Vossiek M., Gold G.:
3D Printed Copper Waveguides by Selective Electron Beam Melting Process for E-Band
EuMW 2019 (Paris)
DOI: 10.23919/EuMC.2019.8910893
Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
DOI: 10.1109/EPEPS47316.2019.193232
Distler F., Sippel M., Schür J., Gold G., Helmreich K., Vossiek M.:
Additively Manufactured Dielectric Waveguides for Advanced Concepts for Millimeter-Wave Interconnects
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 4298-4307
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2939831
Lomakin K., Klein L., Ringel L., Ringel J., Sippel M., Helmreich K., Gold G.:
3D Printed E-Band Hybrid Coupler
In: IEEE Microwave and Wireless Components Letters 29 (2019), p. 580-582
ISSN: 1531-1309
DOI: 10.1109/LMWC.2019.2931458
Lau I., Hajian A., Michler F., Gold G., Lurz F., Schmid U., Helmreich K., Weigel R., Kölpin A.:
Influence of the PCB Manufacturing Process on the Measurement Error of Planar Relative Permittivity Sensors Up To 100 GHz
In: IEEE Transactions on Microwave Theory and Techniques 67 (2019), p. 2793-2804
ISSN: 0018-9480
DOI: 10.1109/TMTT.2019.2910114
URL: https://ieeexplore.ieee.org/document/8698275
Lomakin K., Herold S., Simon D., Sippel M., Sion A., Vossiek M., Helmreich K., Gold G.:
3D Printed Slotted Rectangular Hollow Waveguides
IEEE MTT-S International Microwave Symposium, Boston, USA, Juni, 2019. (Boston, MA)
DOI: 10.1109/MWSYM.2019.8700864
Arz U., Probst T., Kuhlmann K., Ridler N., Shang X., Mubarak F., Hoffmann J., Wollensack M., Zeier M., Phung GN., Heinrich W., Lomakin K., Gold G., Helmreich K., Lozar R., Dambrine G., Haddadi K., Spirito M., Clarke R. (ed.):
Best Practice Guide for Planar S-Parameter Measurements using Vector Network Analysers : EMPIR - 14IND02 PlanarCal
2019
DOI: 10.7795/530.20190424B
Gold G., Lomakin K., Helmreich K., Arz U.:
High-Frequency Modeling of Coplanar Waveguides Including Surface Roughness
In: Advances in Radio Science (2019)
ISSN: 1684-9965
DOI: 10.5194/ars-17-51-2019
Lomakin K., Ankenbrand M., Sippel M., Franke J., Helmreich K., Gold G.:
Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz
1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) (Glasgow, 7. July 2019 - 10. July 2019)
DOI: 10.1109/fleps.2019.8792231
Köppel M., Deckelmann M., Sippel M., Lomakin K., Werzinger S., Gold G., Helmreich K., Schmauß B.:
Using coherent optical frequency domain reflectometry to assist the additive manufacturing process of structures for radio frequency applications
In: SPIE Optics + Photonics: Optical Engineering + Applications 2018
DOI: 10.1117/12.2320944
Lomakin K., Sippel M., Gold G., Ringel J., Weiß D., Helmreich K., Ankenbrand M., Franke J.:
Substituting bond wires by additively manufactured interconnections
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335106
Lomakin K., Sippel M., Gold G., Fröhlich J., Helmreich K., Ankenbrand M., Franke J.:
Low reflective aerosol Jet printed broadband matched load up to 67 GHz
In: German Microwave Conference 2018
DOI: 10.23919/gemic.2018.8335109
Lomakin K., Pavlenko T., Sippel M., Gold G., Helmreich K., Ankenbrand M., Urban N., Franke A.:
Impact of Surface Roughness on 3D printed SLS Horn Antennas
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1235
Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
2018 13th International Congress Molded Interconnect Devices (MID)
DOI: 10.1109/ICMID.2018.8527052
Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), p. 1-1
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2018.2871931
Ankenbrand M., Franke J., Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Weiß D., Helmreich K.:
Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2018)
Lomakin K., Gold G., Helmreich K.:
Analytical Waveguide Model Precisely Predicting Loss and Delay Including Surface Roughness
In: IEEE Transactions on Microwave Theory and Techniques (2018)
ISSN: 0018-9480
DOI: 10.1109/tmtt.2018.2827383
Lomakin K., Simon D., Sippel M., Gold G., Helmreich K., Seler E., Tong Z., Reuter R.:
3D Printed Slotted Waveguide Array Antenna for Automotive Radar Applications in W-Band
In: 48th European Microwave Conference (EuMW 2018) 2018
DOI: 10.23919/EuMC.2018.8541536
Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Helmreich K., Ankenbrand M., Franke J.:
3D Printed Helix Antenna
In: European Conference on Antennas and Propagation (EUCAP) 2018
DOI: 10.1049/cp.2018.1034
Lomakin K., Gold G., Helmreich K.:
Transmission Line Model for Rectangular Waveguides accurately incorporating Loss Effects
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944024
Sippel M., Lomakin K., Gold G., Reitberger T., Neermann S., Helmreich K.:
Simple Approach for brief RF Characterization of thin 3D printable Dielectrics
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944043
Gold G., Helmreich K.:
Modeling Conductor Surface Roughness
In: IMS 2017 Workshop on New Developments in Microwave Measurements for Planar Circuits and Components 2017
Distler F., Gold G., Thurn K., Schür J., Vossiek M.:
Crosstalk Simulation of Multiple Insulated Twisted Pairs based on Transmission Line Theory
In: 21st IEEE Workshop on Signal and Power Integrity (SPI 2017) 2017
DOI: 10.1109/SaPIW.2017.7944033
Sippel M., Lomakin K., Gold G., Helmreich K.:
Characteristics of Anisotropic Conducting Polymers Suggest Feasibility of Test Fixtures up to 110 GHz
In: Electronics (2017)
ISSN: 0013-5070
DOI: 10.3390/electronics6040109
Gold G., Helmreich K.:
A Physical Surface Roughness Model and Its Applications
In: IEEE Transactions on Microwave Theory and Techniques (2017)
ISSN: 0018-9480
DOI: 10.1109/TMTT.2017.2695192
Lomakin K., Sippel M., Gold G., Rochholz P., Helmreich K., Ankenbrand M., Gräf D., Franke J.:
Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen
In: PLUS - Produktion von Leiterplatten und Systemen (2017)
Talai A., Gold G., Frank M., Mann S., Weigel R., Kölpin A.:
A Coplanar Waveguide Resonator Based In-Line Material Characterization Sensor for Bulk and Metallized Dielectrics
In: Frequenz 71 (2016), p. 173–183
ISSN: 0016-1136
DOI: 10.1515/freq-2016-0201
Gold G., Helmreich K.:
Modeling of Transmission Lines with Multiple Coated Conductors
46th European Microwave Week (London)
DOI: 10.1109/EuMC.2016.7824423
Gold G.:
Modeling Surface Roughness in CST Microwave Studio
Computer Simulation Technology - European User Conference (EUC) (Strasbourg)
Sippel M., Gold G., Helmreich K.:
Signal propagation properties of anisotropic conducting polymers up to 110 GHz and their applicability in test fixtures
20th IEEE Workshop on Signal and Power Integrity, SPI 2016
DOI: 10.1109/SaPIW.2016.7496290
Gold G.:
Modellierung rauher Oberflächen und Materialcharakterisierung für den Entwurf von Leiterplatten für Hochfrequenzanwendungen (Dissertation, 2016)
Helmreich K., Gold G.:
Erzeugung von 3D-Funktionsstrukturen für Hochfrequenzanwendungen durch Druckverfahren
In: PLUS - Produktion von Leiterplatten und Systemen (2016), p. 2417-2419
Gold G., Helmreich K.:
Surface Impedance Concept for Modeling Conductor Roughness
IEEE MTT-S International Microwave Symposium 2015 (IMS 2015) (Phoenix, Arizona, USA)
In: Proceedings of the IEEE MTT-S International Microwave Symposium 2015 (IMS 2015) 2015
DOI: 10.1109/MWSYM.2015.7167013
Gold G., Helmreich K.:
Measuring Design-DK and True Permittivity of PCB Materials up to 20 GHz
German Microwave Conference (Nuremberg, Germany)
In: Proceedings of the 9th German Microwave Conference (GeMiC2015) 2015
Gold G., Helmreich K.:
Effective Conductivity Concept for Modelling Conductor Surface Roughness
DesignCon 2014 (Santa Clara (CA), USA, 28. January 2014 - 31. January 2014)
In: Proceedings 2014
Gold G., Helmreich K.:
PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives
European Microwave Week (Nürnberg)
In: Workshop Proceedings W32: PCB Design up to 67 GHz 2013
Gold G., Helmreich K.:
PCB Design up to 67 GHz (W32) - PCBs for Microwave Applications up to 40 GHz and Beyond: Material Characterization, Surface Roughness Consideration, Modeling and Design Perspectives
In: 43th European Microwave Week 2013
Gold G., Helmreich K.:
Measuring Dielectric Properties of PCB Material in the Two-Digit GHz-Range
International Workshop on Impedance Spectroscopy (IWIS 2013) (Chemnitz)
In: Abstract Book 2013
Gold G., Helmreich K.:
A physical model for skin effect in rough surfaces
42th European Microwave Week (Amsterdam)
DOI: 10.23919/EuMC.2012.6459235