Pfahler, Tim

Tim Pfahler, M. Sc.

Project Management: Advanced Module, Antenna and Packaging Development and Assembly

Department of Electrical-Electronic-Communication Engineering
Institute of Microwaves and Photonics (LHFT)

Room: Raum 05.230
Cauerstr. 9
91058 Erlangen

Education

  • B.Sc. in Medical Engineering (2013-2017)
  • M.Sc. in EEI (2017-2019)
  • Doctoral Candidate at LHFT since October 2019

Research Areas

  • Antenna-Design up to 325 GHz
    • onChip-Antennas (AoC)
    • inPackage-antennas (AiP)
  • Millimeterwave-interconnect design
  • RF measurement technology (0-325 GHz)
    • VNA-analysis
    • Spectrum-analysis
  • Material characterization
    • Printed circuit board materials
    • IC-package materials

Thesis

Feel free to contact me if you are interested in any of the topics mentioned above.

Publications

  • N. Zocher, T. Pfahler, M. Vossiek and C. Carlowitz, "Printed Circuit Board Material Characterization at Millikelvin Temperatures for Cryogenic Microwave Circuit Design", in Proceedings of the 2024 54th European Microwave Conference (EuMC), pp. 501-504, Paris, Oktober, 2024.
    DOI: 10.23919/EuMC61614.2024.10732291
  • D. Hecht, T. Pfahler and M. Vossiek, "Investigation of the Electromagnetic Wave-Tissue Interaction of a 75–110 GHz Reflective Resonator Probe for Tissue Classification", in Proceedings of the 2024 54th European Microwave Conference (EuMC), pp. 321–324, Paris, Oktober, 2024.
    DOI: 10.23919/EuMC61614.2024.10732329
  • T. Pfahler, J. Schür and M. Vossiek, "Compact 150 GHz and 300 GHz Dual-Band On-Chip Antenna for Future Communication and Sensing Applications", in Proceedings of the 2024 IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater, Mai, 2024.
    DOI: 10.1109/WAMICON60123.2024.10522801
  • A. Scheder, T. Pfahler, A. Bridier and M. Vossiek, "An Ultra-Wideband Microstrip Gain Equalizer on Thin-Film Ceramic for Future Millimeter Wave Applications up to and Beyond 120 GHz", in Proceedings of the 2024 IEEE Wireless and Microwave Technology Conference (WAMICON), Clearwater, Mai, 2024.
    DOI: 10.1109/WAMICON60123.2024.10522854
  • T. Pfahler, S. Breun, L. Engel, C. Geissler, J. Schür and M. Vossiek, "Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz", IEEE Transactions on Components, Packaging and Manufacturing Technology, pp. 1-1, April, 2024.
    DOI: 10.1109/TCPMT.2024.3386959
  • T. Pfahler, A. Scheder, A. Bridier, M. Nagel and M. Vossiek, "A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs", IEEE Journal of Microwaves, vol. 4, no. 3, pp. 404-415, 2024.
    DOI: 10.1109/JMW.2024.3406919
  • L. Hahn, T. Pfahler, T. Bader, G. Gold, M. Vossiek and C. Carlowitz, "3D-Printed Dielectric Image Lines Towards Chip-to-Chip Interconnects for subTHz-Applications", in Proceedings of the 2024 IEEE International Conference on Microwaves, Communications, Antennas, Biomedical Engineering and Electronic Systems, COMCAS 2024, Tel Aviv, ISR, 2024.
    DOI: 10.1109/COMCAS58210.2024.10666228
  • T. Pfahler, A. Scheder, A. Bridier, J. Schür and M. Vossiek, "A Low-Loss Bond-Wire Interconnect Design With More Than 130 GHz Bandwidth Enabling an Ultra-Broadband Heterogeneous System Design", IEEE Transactions on Microwave Theory and Techniques, vol. 72, pp. 505-515, September, 2023.
    DOI: 10.1109/TMTT.2023.3314113
  • T. Pfahler, A. Scheder, A. Bridier, J. Schür and M. Vossiek, "A Novel Ultra-Broadband Low-Loss Bond-Wire Interconnect Design Concept Applied to a 2 GHz to 135 GHz Substrate-to-Substrate Interface", in Proceedings of the 2023 IEEE/MTT-S International Microwave Symposium - IMS 2023, San Diego, CA, Juli, 2023.
    DOI: 10.1109/IMS37964.2023.10188177
  • B. Dorbath, K. Lomakin, T. Pfahler, J. Schür and M. Vossiek, "Single-Fed Additively Manufactured Conical Horn Antenna with Circular Polarization for Millimeter-Wave Applications", in Proceedings of the 2023 17th European Conference on Antennas and Propagation (EuCAP), Florence, Mai, 2023.
    DOI: 10.23919/EuCAP57121.2023.10132938
  • T. Pfahler, G. Gold, F. Bachbauer, J. Schür and M. Vossiek, "Complex Permittivity Extraction of IC-Package Materials beyond 110 GHz by Band-Limited Waveguide-Cavity Measurements", in Proceedings of the 2023 53rd European Microwave Conference, EuMC 2023, pp. 568-571, Berlin, DEU, 2023.
    DOI: 10.23919/EuMC58039.2023.10290476
  • T. Pfahler, M. Vossiek and J. Schür, "Compact and Broadband 300 GHz Three-Element on-chip Patch Antenna", in Proceedings of the IEEE Radio and Wireless Symposium, RWS, pp. 139-142, Las Vegas, NV, 2023.
    DOI: 10.1109/RWS55624.2023.10046297
  • A. Scheder, T. Pfahler, A. Bridier, J. Schür and M. Vossiek, "An Ultra-Wideband DC-Block on Thin-Film Ceramic for the Next Generation of Test and Measurement Applications Up to 150 GHz", in Proceedings of the 2023 53rd European Microwave Conference, EuMC 2023, pp. 46-49, Berlin, DEU, 2023.
    DOI: 10.23919/EuMC58039.2023.10290662
  • D. Hecht, T. Pfahler, I. Ullmann, T. Altstidl, N. Amer, Y. Jin, B. Eskofier and M. Vossiek, "In Vivo Skin-Type Classification Using Millimeter-Wave Near-Field Probe Spectroscopy", in Proceedings of the 2022 52nd European Microwave Conference, Milan, November, 2022.
    DOI: 10.23919/EuMC54642.2022.9924376
  • F. Bachbauer, K. Lomakin, T. Pfahler and G. Gold, "A Method for Extracting an Apparent Permittivity from Band Limited Measurements of Homogeneously Filled Transmission Lines", in Proceedings of the 2022 52nd European Microwave Conference (EuMC), Milan, November, 2022.
    DOI: 10.23919/EuMC54642.2022.9924444
  • D. Hecht, I. Ullmann, D. Oppelt, T. Pfahler, N. Amer and M. Vossiek, "Millimeter-wave imaging and near-field spectroscopy for burn wound assessment", Frequenz, August, 2022.
    DOI: 10.1515/freq-2022-0100
  • L. Engel, K. Lomakin, G. Gold, T. Pfahler, J. Schür and M. Vossiek, "3D Printed Waveguide Transition for 77 GHz Radar Applications", in Proceedings of the Published in: 2022 14th German Microwave Conference (GeMiC), Ulm, Germany, Mai, 2022.
  • T. Pfahler, G. Gold, K. Lomakin, L. Engel, J. Schür and M. Vossiek, "Ultra-Wideband Complex Permittivity Extraction of IC Packaging Materials beyond 100 GHz", in Proceedings of the 2021 IEEE MTT-S International Microwave Symposium, Atlanta, Oktober, 2021.
    DOI: 10.1109/IMS19712.2021.9574950